Thermal energy-driven cooling system and related methods

ABSTRACT

A cooling system includes a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid, an expander fluidly coupled with the heat exchanger and configured to reduce a pressure of the internal fluid received from the heat exchanger, a first air-cooled condenser fluidly coupled with the expander and configured to air cool the internal fluid that is received from the expander, a compressor fluidly coupled with the first air-cooled condenser and configured to increase the pressure of the internal fluid received from the first air-cooled condenser, and a second air-cooled condenser fluidly coupled with the compressor and configured to air cool the internal fluid received from the compressor.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Provisional Application No. 62/730,596, filed 13 Sep. 2018, and is a continuation-in-part of U.S. application Ser. No. 15/049,857, filed 22 Feb. 2016. The entire disclosures of these applications are incorporated herein by reference.

FIELD

The subject matter described herein relates to cooling systems.

BACKGROUND

One example of an industrial application that may require one or more cooling effects to function properly includes information technology (IT) equipment, such as the computer servers that make up data centers. As data transmission and storage (e.g., cloud computing) become an ever-increasing aspect of modern life, more and more computer servers and similar devices (which are also becoming increasingly powerful and therefore are generating more and more heat) are utilized. The functioning of these computational devices generates heat that is inherently harmful to the devices. Being able to efficiently maintain these devices within acceptable temperatures at reasonable costs is becoming a growing concern with data center cooling. Currently available means of cooling data centers struggle with finding an optimum balance regarding issues such as energy consumption, water usage, and efficiency while reducing damage to electronic components.

Regarding energy consumption, most data centers utilize a significant amount of energy to power overhead processes (including cooling processes) as well as to power the servers. The data industry continuously strives to increase data service while reducing the energy required to perform functions that are not directly value-added. This efficiency is measured using power usage effectiveness (PUE). PUE measurements calculate the amount of wattage used to power support functions compared to the amount of wattage used to perform the actual IT functions for the end-user. For example, a data center with a PUE of 2.0 would use one watt of electricity for cooling and support functions for every watt used to perform the computing functionality for the end user. An average modern data center has a PUE of 1.7, which represents a 42% auxiliary load for overhead process consumption.

It has been estimated that one-third to one-half of a data center's electrical cost is attributed to the functioning of the cooling system. Some entities have raised the temperature inside data centers, particularly the inlet temperatures, to try and reduce these costs. While this has improved efficiency, this solution damages the long-term reliability of the electronics. High energy consumption by existing cooling systems also prolongs the amount of time needed for the servers within a data center to boot back up if a power failure occurs.

Within some data center cooling processes, chillers can be the biggest energy consumers. To reduce the need for chillers, some data center cooling processes utilize low temperature ambient air or evaporating water technologies. Some companies eliminate the need for chillers altogether by using a cooling process that pulls hot air away from the IT equipment and distributing the hot air over cool water pipes that serve as a heat exchanger, thereby cooling the air before returning the air back to the data center. The heated water is then run through large cooling towers that use evaporation techniques to cool the water before returning the water to the data center to cool more hot air away from the equipment. This process is not ideal in that the process has issues with regard to inefficiency, reliability, safety, emission, the environment, and design restrictions.

Additionally, water usage associated with cooling the hundreds of thousands of servers housed in today's mega data centers is a significant concern in the industry. According to one estimate, a 15-megawatt data center can use up to 360,000 gallons of water per day. Such high water usage is becoming a notable concern for local and federal government entities that are working to improve the increasingly serious drought conditions within various portions of the United States and the rest of the world. In fact, lawmakers are considering a bill that would shut off water to the National Security Agency data center in Bluffdale, Utah due to the 1.7 million gallons of water used by the data center per day. To further illustrate the high energy consumption and water usage associated with modern data center cooling, the United States Geological Survey attributes two percent of the electricity consumed in the U.S. to data center operations which translates to approximately 165 billion gallons of water used in 2014, with that amount projected to reach 174 billion gallons by 2020.

California has perhaps the most significant issues with water usage related to data center cooling, being home to more than 800 data centers. It is estimated that California's data centers use more than 158,000 Olympic-sized swimming pools worth of water every year. Not only does this water get used by wet cooling towers used to cool the air surrounding the IT equipment; but, more significantly, a large portion of the water usage goes to the processes that produce the energy needed to run the data centers.

Other data center cooling methods have been attempted to address the concerns regarding water usage. For example, direct air cooling has been attempted; however, direct air cooling is significantly less efficient than wet cooling techniques. Additionally, direct air cooling is associated with airborne particulate contamination and inconsistent air temperatures that pose a notable risk for IT equipment failure. Furthermore, the cost of construction for these units is substantial, and there is a large required facility footprint.

Some companies have utilized direct evaporative cooling for data centers where warm air pulled from IT equipment passes through an adiabatic media that is dampened by a small flow of water. The air gets cooled as the air passes through the wet media. While this technique does reduce water usage, this technique still requires about the same amount of energy as direct cooling processes.

Other various data cooling methods have been utilized, including indirect evaporative cooling, which uses direct evaporation to cool an outside air supply which is then taken through a heat exchanger to cool a closed-loop air supply that is then blown over IT equipment, as well as direct expansion computer room air conditioner systems that use an air-to-refrigerant heat exchanger to remove heat, among others. These cooling methods, however, provide only provide incremental improvement with regard to excessive data center energy and water usage. Additionally, where some methods do significantly reduce water usage, these methods can underperform in terms of PUE, energy consumption, and cooling efficiency.

In addition to the energy consumption and water usage concerns outlined above, current data center cooling systems comprise issues regarding local sewer capacities, fire hazards, spreading Legionnaires' disease, collapsing wooden structures, carbon emissions, and ecological waste water concerns, among others.

BRIEF SUMMARY

In one embodiment, a cooling system includes a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid and a stack heat recovery steam generator fluidly coupled with the heat exchanger and configured to receive the internal fluid that is heated by the thermal energy transferred to the internal fluid by the heat exchanger. The stack heat recovery steam generator is configured to heat the internal fluid received from the heat exchanger. The cooling system also includes an expander fluidly coupled with the stack heat recovery steam generator and configured to reduce a pressure of the internal fluid that is received from the stack heat recovery steam generator. The expander is configured to be coupled with a generator and to drive the generator to generate electric current. The cooling system includes a first air-cooled condenser fluidly coupled with the expander and configured to be conductively coupled with the generator. This first air-cooled condenser is configured to receive the internal fluid from the expander and to air cool the internal fluid. The first air-cooled condenser also is configured to be powered by the electric current generated from the expander driving the generator. The cooling system also includes a compressor fluidly coupled with the first air-cooled condenser and configured to be conductively coupled with the generator. The compressor is configured to increase the pressure of the internal fluid and to be powered by the electric current generated from the expander driving the generator. The cooling system includes a second air-cooled condenser fluidly coupled with the compressor and configured to be conductively coupled with the generator. This second air-cooled condenser is configured to receive the internal fluid from the compressor and to air cool the internal fluid. The second air-cooled condenser also is configured to be powered by the electric current generated from the expander driving the generator. The cooling system also includes an expansion valve fluidly coupled with the second air-cooled condenser and with the heat exchanger such that the expansion valve is between the second air-cooled condenser and the heat exchanger. The expansion valve is configured to reduce the pressure of the internal fluid before returning the fluid to the heat exchanger.

Another example of a cooling system includes a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid, an expander fluidly coupled with the heat exchanger and configured to reduce a pressure of the internal fluid received from the heat exchanger, a first air-cooled condenser fluidly coupled with the expander and configured to air cool the internal fluid that is received from the expander, a compressor fluidly coupled with the first air-cooled condenser and configured to increase the pressure of the internal fluid received from the first air-cooled condenser, and a second air-cooled condenser fluidly coupled with the compressor and configured to air cool the internal fluid received from the compressor.

In one embodiment, a cooling method includes transferring thermal energy from a heat source to an internal fluid using a heat exchanger, reducing a pressure of the internal fluid received from the heat exchanger using an expander that is fluidly coupled with the heat exchanger, air cooling the internal fluid that is received from the expander in a first air-cooled condenser that is fluidly coupled with the expander, increasing the pressure of the internal fluid received from the first air-cooled condenser in a compressor that is fluidly coupled with the first air-cooled condenser, and air cooling the internal fluid that is received from the compressor in a second air-cooled condenser that is fluidly coupled with the compressor.

BRIEF DESCRIPTION OF THE DRAWINGS

The features and advantages of the present disclosure will become more apparent from the Detailed Description set forth below when taken in conjunction with the drawings in which like reference numbers indicate identical or functionally similar elements.

FIG. 1 schematically illustrates a cooling system;

FIG. 2 schematically illustrates another cooling system;

FIG. 3 illustrates a flowchart of a cooling process;

FIG. 4 illustrates a flowchart of another cooling process;

FIG. 5 schematically illustrates another cooling system;

FIG. 6 schematically illustrates another cooling system;

FIG. 7 schematically illustrates another cooling system;

FIG. 8 schematically illustrates another cooling system;

FIG. 9 illustrates a flowchart of another cooling process;

FIG. 10 illustrates a flowchart of another cooling process;

FIG. 11 illustrates a flowchart of another cooling process;

FIG. 12 illustrates a flowchart of another cooling process;

FIG. 13 illustrates a computing control system that can control operations of the cooling systems described herein.

DETAILED DESCRIPTION

The inventive subject matter described herein is directed to cooling systems and methods for various processes, systems, pieces of equipment, enclosures, substances, and/or locations, including various pieces of industrial equipment, industrial systems, and/or industrial processes. The cooling systems and methods may require little or no water to function, may have increased efficiency in use, may have relatively low maintenance needs and operational costs, may have relatively high flexibility regarding physical placement location and operational climate, may require relatively few materials and/or components (such as minimal or reduced piping and/or minimal or reduced amounts of components), and take up a relatively small amount of physical space (relative to at least some known cooling systems and methods).

The cooling systems and methods may use at least one heat exchange device to transfer an amount of heat energy from one or more heat sources to at least one internal fluid to cause the internal fluid to undergo one or more changes in pressure, temperature, and/or enthalpy. Specifically, the cooling systems and methods may use the internal fluid's changes in pressure, temperature, and/or enthalpy to generate one or more forms of energy that may be captured and converted to at least one useable form of energy that may be used to power at least one component of the disclosed cooling systems and/or one or more external systems, processes, machines, apparatus, and/or devices.

The use of the one or more internal fluids at various pressure, temperature, and/or enthalpy states within the cooling systems and methods of the present disclosure may, in some aspects, negate, reduce, or minimize the need to use water within such cooling systems and methods, thereby allowing the cooling systems to operate more efficiently, be more cost effective in use, require less maintenance, be more environmentally friendly, be subject to fewer government restrictions, and be readily adaptable for use in a wide variety of locations and/or climates. Additionally, the relatively compact size and low component count of the cooling systems and methods in accordance with the present disclosure may allow them to require less space in which to be installed as well as less material from which to be built.

The cooling systems and methods may provide cooling effects to temperatures below those obtainable by currently available dry cooling systems without requiring energy input other than heat from one or more sources, such as heat from source(s) that are to be cooled. Furthermore, the cooling systems and methods may provide cooling capacities similar to or greater than those that are currently attainable via wet cooling systems while requiring little or no water to function. The cooling systems and methods may be able to provide a cooling effect to one or more heat sources to temperatures as low as or lower than the wet-bulb temperature.

The cooling systems and methods may provide a cooling effect to one or more thermoelectric power plants. This may allow those power plants to function more reliably and efficiently and/or experience increased power generation since they are not dependent on source water availability or source water temperature.

Optionally, the cooling systems and methods in accordance with the present disclosure may be used to provide a more efficient cooling effect to devices that produce waste heat. Waste heat may be a byproduct of operation of a device, such as computer equipment, instead of the purposeful generation of heat (e.g., by thermoelectric plants). For example, waste heat may be heat generated by operation of a device where the purpose of the device is not to generate heat to perform some other work. The heat purposefully created by thermoelectric plants is not waste heat as the heat is generated for the purpose of creating electric current. Conversely, computer processors generate waste heat as a byproduct of operation and not to perform some other work or output.

The cooling systems described herein can include an apparatus, device, machine, or appliance (or any combination thereof) that may be used to control the temperature of a one more objects, machines, devices, apparatus, areas, locations, enclosures (including industrial and domestic building interiors), systems, substances, pieces of equipment, and/or processes, such as thermoelectric power generation equipment and/or processes, IT equipment (such as computer servers), the inside of commercial or residential buildings, auxiliary and/or manufacturing equipment that is being used, and the like.

The internal fluids described herein can include any fluid that may be utilized to facilitate the operation of cooling systems and processes, including liquids, gases, supercritical fluids, transcritical fluids, and subcritical fluids. As one example, an internal fluid may comprise one or more fluids capable of effectively absorbing and dissipating heat as well as undergoing substantial changes in pressure and/or enthalpy. Fluids that may comprise the internal fluid may include one or more halocarbons, water, supercritical carbon dioxide and transcritical carbon dioxide, as well as any other appropriate fluid(s), and any combination thereof. By way of example and not limitation, the internal fluid may comprise one or more transcritical fluids capable of effectively absorbing and dissipating heat as well as undergoing substantial changes in pressure and/or enthalpy, sometimes relatively quickly, and/or achieving and/or maintaining any one of a wide range of temperature, pressure, and/or enthalpy levels.

Heat sources described herein include various processes (including any industrial or domestic process), systems, equipment, enclosures, substances, locations, machines, apparatuses, devices, or similar elements that produce, generate, and/or contain an amount of unwanted and/or hazardous heat energy that may be removed using the cooling systems and methods described herein. Examples of heat sources include thermoelectric power plants and associated processes, data center interiors, IT equipment, computer servers, central processing units (CPUs), electrical components, lubrication oil processes, air inlet structures/sites/functions, steel mill interiors and associated processes, chemical plant interiors and associated processes, plastic manufacturing processes, metal manufacturing processes, paper mill interiors and associated processes, oil and gas refinery systems and associated processes, glass fabrication processes, airport interiors, sport facility interiors, shopping mall interiors, cold storage space interiors, warehouse interiors, cell towers, super computers, and the like.

FIG. 1 schematically illustrates a cooling system 100. The cooling system 100 may be configured to remove an amount of heat energy from at least one heat source 102. In some nonlimiting example embodiments, heat source 102 may comprise, by way of example and not limitation, heat from one or more power generation facilities, systems, pieces of equipment, and or processes, such as a thermoelectric power plant and/or one or more components and/or processes associated therewith (such as, for example and not limitation, steam from one or more boilers); heat generated by one or more pieces of IT equipment, such as one or more computer severs in a data center; heat dissipated by one or more components (such as a condenser device) associated with an existing cooling system; as well as any similar machines, apparatus, devices, appliances, areas, systems, pieces of equipment, enclosures, substances, locations, and/or processes. In one embodiment, the cooling system 100 removes waste heat generated by a computing device, such as IT equipment.

The cooling system 100 includes at least one heat exchange device or heat exchanger 104. The heat exchanger 104 can include one or more of a variety of different heat exchangers, such as a shell and tube heat exchanger, a plate heat exchanger, a plate and shell heat exchanger, a plate fin heat exchanger, a pillow plate heat exchanger, a fluid heat exchanger, a helical coil heat exchanger, a dynamic scraped surface heat exchanger, an adiabatic wheel heat exchanger, a phase-change heat exchanger, a direct contact heat exchanger, a micro heat exchanger, a waste heat recovery unit, a microchannel heat exchanger, an air coil heat exchanger, a spiral heat exchanger, etc.

The cooling system 100 also includes at least one expanding device or expander 106. The expander 106 may comprise at least one expanding device of any appropriate form and/or configuration, including a reciprocating expander, a centrifugal expander, a turbine, and the like.

The illustrated cooling system 100 includes at least two condensers or condenser devices 108, such as a first air-cooled condenser device 108 a and a second air-cooled condenser device 108 b. The condenser devices 108 may be used to dissipate thermal energy from an internal fluid passing through the condenser devices 108 to one or more external bodies to cooling system 100. By way of example, these external bodies capable of receiving heat from the internal fluid may include ambient air, fluid(s)/gas(es) utilized by other systems and/or processes, a portion of the internal fluid within other portions of cooling system 100, any type of heat sink, a large body of water, or any other appropriate heat receiving element(s). The condenser devices 108 may comprise air-cooled condensers in the form of one or more modules configured in rows that are substantially parallel to each other. Each module may comprise one or more fin tube bundles and at least one axial-flow, forced-draft fan that forces air to flow past a heat exchange area of the fin tubes. The air flow may facilitate the absorption of heat from the internal fluid and may then send the absorbed heat to one or more bodies, areas, elements, and/or objects external from cooling system 100. The condensers 108 may not use water to cool the internal fluid of the cooling system. Instead, the condensers 108 use air (e.g., ambient air or cooled air) to cool the internal fluid. Other configurations may be used for condenser devices 108.

The cooling system 100 can include at least one compressor device or compressor 110. The compressor 110 may include at least one compressor device of any appropriate form and/or configuration, such as a reciprocating compressor, an ionic liquid compressor, a rotary vane compressor, a rotary screw compressor, a rolling piston compressor, a scroll compressor, a diaphragm compressor, an air bubble compressor, a centrifugal compressor, a mixed flow compressor, an axial compressor, or the like. The compressor 110 may be configured to alter the internal fluid from a relatively low pressure state to a relatively high pressure state (or, in some aspects, from a relatively low pressure state to a relatively moderate pressure state, or, in some additional aspects, from a relatively moderate pressure state to a relatively high pressure state). This change in pressure state may occur very quickly.

Power supply connections 118 represent conductive connections between components of the cooling system 100. These connections 118 can be wires, cables, buses, generators, motors, batteries, or the like, for generating and/or conducting electric current between the expander 106, the first air-cooled condenser 108 a, the second air-cooled condenser 108 b, and/or the compressor 110.

The cooling system 100 includes conduits 112, 114, 116 (also referred to herein as piping) that fluidly couple the components described herein with each other. An internal fluid contained within cooling system 100 may travel to the various components via the conduits 112, 114, 116 as shown in FIG. 1. A first conduit 112 a fluidly couples the heat exchanger 104 with the expander 106, a second conduit 114 a fluidly couples the expander 106 with the first air cooled condenser 108 a, a third conduit 114 b fluidly couples the expander 106 with the compressor 110, a fourth conduit 116 a fluidly couples the compressor 110 with the second air cooled condenser 108 b, a fifth conduit 116 b fluidly couples the second air cooled condenser 108 b with an expansion valve 120 (described herein), and a sixth conduit 112 b fluidly couples the expansion valve 120 with the heat exchanger 104.

The conduits may be low, moderate, or high-pressure piping. For example, the pressure of the fluid moving through the conduits 114 may be lower than the fluid pressures inside the conduits 112, 116, the pressure of the fluid moving through the conduits 116 may be greater than the fluid pressures inside the conduits 112, 114, and the pressure of the fluid moving through the conduits 112 may be lower than the pressure of the fluid inside the conduits 116 but greater than the pressure of the fluid inside the conduits 114. By way of example, moderate pressure conduits 112 may be configured to contain at least one portion of the internal fluid when the fluid is at a relatively moderate pressure state, low pressure conduits 114 may be configured to contain at least one portion of the internal fluid when the fluid is at a relatively low or lower pressure state and high pressure conduits 116 may be configured to contain at least one portion of the internal fluid when the fluid is at a relatively high or higher pressure state. For example, the high pressure conduits 116 may be configured to carry fluids at greater pressures than the moderate or low pressure conduits 112, 114, the moderate pressure conduits 112 may be configured to carry fluids at greater pressures than the low pressure conduits 114 but not the high pressure conduits 116, and/or the low pressure conduits 114 may not be able to carry fluids at the pressures at which the high and moderate pressure conduits 112, 116 can carry fluids.

The cooling system 100 may comprise additional or fewer numbers of any of these components (or none of one or more of the components) to alter the performance and/or efficiency of the cooling system 100. Additionally, other similar devices may be used in place of the examples given herein to achieve the same or similar functionality.

The internal fluid may quickly absorb and dissipate heat, withstanding substantial and timely changes in pressure and/or enthalpy states, and/or achieving and/or maintaining significantly high and/or low temperature, pressure, and/or enthalpy states. By way of example, the internal fluid may at least partially comprise transcritical carbon dioxide, or any other appropriate internal fluid(s) or substance(s) in various combinations, including those previously listed. Additionally, moderate pressure conduits 112, low pressure conduits 114, and/or high pressure conduits 116, as well as any section(s) thereof, may comprise any appropriate form(s), configuration(s), and/or material(s) capable of containing the at least one portion of the internal fluid at the required temperature, pressure, and/or enthalpy states, including one or more pipes, tubes, hoses, and the like, any of which may comprise metal, rubber, glass, plastic, other polymers, or any similar appropriate sub stance(s).

In some aspects, the internal fluid may at least partially comprise transcritical carbon dioxide. Transcritical carbon dioxide may be advantageous in that it is environmentally benign, nontoxic, inexpensive, nonflammable, abundant in nature, and has favorable heat and mass transport properties that may allow the cooling system 100 to be highly efficient at relatively low heat qualities. Additionally, the relatively high energy density of transcritical carbon dioxide may help enable the cooling system 100 to be safer, to be more efficient, to require less maintenance, to take up less space by requiring fewer and/or smaller components and/or by requiring less materials, to be easier to install (fewer/smaller components and less materials needed), and to facilitate an increase in profitability for any thermoelectric power plant(s), computer servers, or other pieces of industrial equipment and/or industrial systems and/or processes associated therewith by increasing the efficiency and performance capabilities of the equipment, system(s), and/or process(es) while maintaining cooling capacities similar to or greater than currently available cooling systems.

Being that transcritical carbon dioxide has a relatively high working pressure, use of transcritical carbon dioxide may allow the cooling system 100 to be constructed in a more compact form than if other substances were used, thereby allowing the cooling system 100 to be relatively small in size, inexpensive, and/or easy to build or install. Furthermore, the relatively high thermal conductivity, the relatively low viscosity, relatively high density, and relatively high volumetric heat capacity of transcritical carbon dioxide may make transcritical carbon dioxide well suited for moving and holding appropriate amounts of energy that allow the cooling system 100 to function well. Carbon dioxide is also desirable in that transcritical carbon dioxide is clean, non-scaling, and non-fouling and, when maintained in a dry condition, is noncorrosive. As an added benefit, the single-phase heat transfer process of carbon dioxide allows for simpler, more efficient, and more robust designs to be utilized for the heat exchanger 104. This may allow the heat exchanger 104 to comprise a smaller size than it otherwise would, thereby allowing to have a lower “table-top,” which may allow it to be constructed using less structural steel, a smaller slab size, and with lower costs than it would otherwise.

The heat exchanger 104 may be configured to exchange and/or transfer heat energy from at least one heat source 102 with or to the internal fluid. By way of example, heat source 102 may comprise or produce incoming heat 102 b from steam, such as waste heat generated by the functioning of one or more pieces of IT equipment (e.g., one or more computer servers in one or more data centers). Alternatively, the heat source 102 may product heat 102 b produced by one or more boilers associated with a thermoelectric power plant. In one embodiment, the heat exchanger 104 can be close to, but not in conductive contact with, the heat source 102 to transfer thermal energy from the heat source 102 to the heat exchanger 104. Alternatively, the heat exchanger 104 can be in direct contact with the heat source 102. For example, the heat exchanger 104 can directly abut a heat source 102 such as a processor, graphics card, or the like, of a computer, computer server, or the like, for conductive heat transfer between the heat source 102 and the heat exchanger 104. Additionally or alternatively, the heat source 102 may comprise heat generated by the operation of cooling system 100, heat from an external power source, heat dissipated by one or more components (such as a condenser device) of an existing cooling system, or any other appropriate heat source.

In aspects where the cooling system 100 may be used to provide a cooling effect to a thermoelectric power plant, the heat exchanger 104 may take the form of at least one surface condenser that functions to convert incoming heat from a gaseous state (e.g., steam from one or more boilers) to a liquid state (e.g., water) at a pressure below atmospheric pressure. The water may then, for example and not limitation, be sent back to the thermoelectric power plant to be reheated in the boiler(s) from which the water came to produce more steam.

In one embodiment, during operation of the heat exchanger 104, no portion of cooling system 100 or the internal fluid may exchange mass with the incoming heat from heat source(s) 102 and/or any outgoing water 102 a (if relevant). Rather, only the heat energy 102 b from heat source(s) 102 may be transferred to the internal fluid within the cooling system 100. By way of example, the heat exchanger 104 may comprise a water-cooled shell and tube heat exchanger, a surface condenser, as well as any other appropriate embodiment and/or configuration. Alternatively, the heat exchanger 104 may not have any outgoing water 102 a. Optionally, instead of water, another cooling fluid could be used, such as lube oil, nitrogen, or the like.

The expander 106 alters the internal fluid from a relatively moderate pressure state to a relatively low pressure state (or, in some aspects, from a relatively high pressure state to a relatively low pressure state, or, in some additional aspects, from a relatively high pressure state to a relatively moderate pressure state). This change in pressure state may occur in a relatively short amount of time, thereby generating an amount of mechanical energy via the expansion of the internal fluid. By using one or more energy conversion mechanisms 107, such as, by way of example and not limitation, one or more mechanical power transmission devices and/or techniques, at least one electric motor and/or generator in circuit, or any other appropriate technique(s) or mechanism(s), at least one portion of the mechanical energy generated by the expander 106 may be captured/harnessed and converted into at least one useable form of energy. For example, energy in mechanical and/or electrical form may be used to drive a generator 107 to generate electric current that at least partially powers one or more of: first condenser device 108 a, second condenser device 108 b, compressor 110, and/or any other component(s) of the cooling system 100 (e.g., via the connections 118). The connections 118 can conductively couple the generator that is driven by the expander to conduct the generated electric current to the devices 108 a, 108 b, compressor 110, or the like.

The expander 106 may generate more than enough energy to power first and/or second condenser devices 108 a-b, compressor 110, and/or some or all other components that may be associated with cooling system 100. The excess energy generated by expander 106 may be converted to usable electricity by one or more generators or similar devices or apparatus for uses external from cooling system 100. The excess energy generated by expander 106 may be used to power one or more components of a thermoelectric power plant; one or more pieces of IT equipment (e.g., one or more computer servers within one or more data centers; or any component(s) of any facility, business, residence, structure, machine, system, process, or the like), thereby helping to reduce the emissions given off by and/or reduce the external electrical consumption of the plant, data center, or other structure, machine, system, process, etc. Excess energy generated by the cooling system 100 may be stored for later use in any appropriate energy storage device(s) (such as, for example and not limitation, within one or more batteries). The energy storage device(s) may be configured internal to and/or external from cooling system 100. In still some additional aspects, excess energy generated by cooling system 100 may distributed and/or sold to one or more power companies associated with one or more electrical grids.

The expansion valve 120 may decrease the pressure of the internal fluid to alter the fluid from a relatively high pressure state to a relatively moderate pressure state (or, in some aspects, from a relatively high pressure state to a relatively low pressure state, or, in some additional aspects, from a relatively moderate pressure state to a relatively low pressure state). In some embodiments, this change in pressure state may occur in a relatively short amount of time. This decrease in pressure may simultaneously or concurrently cause the temperature and enthalpy of the internal fluid to decrease. By decreasing the temperature and enthalpy of the internal fluid before the fluid enters the heat exchanger 104, the internal fluid may be able to absorb more heat from heat source(s) 102 that may interact with the internal fluid, either directly or indirectly.

Additionally, lowering the pressure of the internal fluid may allow for improved functioning of heat exchanger 104 and/or reduce damage thereto. By way of example, the expansion valve 120 may comprise an internally-equalized expansion valve, an externally-equalized expansion valve, as well as any similar device or mechanism. Alternatively, the cooling system 100 may not include the expansion valve 120 or any other expansion valve. For example, the second air-cooled condenser 108 b may be coupled with the heat exchanger 104 by conduits 112 and/or 116 without the expansion valve 120 being between the second air-cooled condenser 108 b and the heat exchanger 104.

The cooling system 100 may be integrated with one or more energy storage devices. These energy storage devices may comprise any appropriate form such as, by way of example and not limitation, one or more batteries of any appropriate configuration. The energy storage device(s) may be configured internally to and/or externally from the cooling system 100, and may facilitate one or more energy transfer processes for/within the cooling system 100 by storing captured and/or generated energy and providing/dispersing energy to where the energy may be needed at appropriate times.

In selecting one or more appropriate internal fluids for use in the cooling system 100, it may be beneficial to select internal fluid(s) that allow for more energy to be generated by expander 106 than is required by condenser devices 108, compressor 110, and/or any or all other component(s) of cooling system 100. This can allow the cooling system 100 to be at least partially self-powered, which may allow the cooling system 100 to provide cooling effects while requiring little to no power or electrical input other than heat from one or more heat sources 102. This also can allow the cooling system 100 to provide energy in various forms that may be used to power one or more components of a thermoelectric power plant (thereby helping to reduce the plant's emissions), to power one or more pieces of IT equipment (e.g., one or more computer servers in one or more data centers) (thereby to reduce the external electricity consumption of the data center(s)), to be distributed and/or sold to one or more power companies associated with one or more electrical grids, for one or more other applications external from cooling system 100 (such as, by way of example and not limitation, to provide power to a facility, business, residence, structure, machine, process, or the like), or the like. The heat exchanger 104, expander 106, first and second condenser devices 108 a-b, and/or compressor 110 may comprise sizes, materials, and/or configurations that may allow for the occurrence of the necessary thermodynamic states of the selected internal fluid(s) that allow the cooling system 100 to function.

In operation, the internal fluid absorbs thermal energy (e.g., heat) 102 b from the heat source 102 as the fluid is located in and/or moving through the heat exchanger 104. The pressure and/or temperature of the internal fluid increases and some or all the fluid may change phase (e.g., to a supercritical state or to a vapor state) before or while moving through the conduit 112A to the expander 106. The fluid expands within the expander 106 to at least partially reduce the pressure and/or temperature of the fluid. The temperature and/or pressure can be reduced, but not to the pressure and/or temperature of the fluid prior to entering the heat exchanger 104 from the conduit 112B. At least some electric current can be generated by expansion of fluid in the expander 106. At least part, but not all, of the fluid can change phases in or upon exiting the expander 106 to a liquid (from the supercritical or vapor state) or may stay in the same supercritical or vapor state upon exiting the expander 106. The fluid then moves through the conduit 114A to the first air-cooled condenser 108 a, where the fluid is cooled and changes phase to a liquid state (e.g., all or the remaining part of the fluid that is not in the liquid state changes to the liquid state). At least some of the electric current generated by fluid passing through the expander 106 may be used to power the first air-cooled condenser 108 a.

The liquid internal fluid then moves through the conduit 114B to the compressor 110. The pressure of the internal fluid is then increased by the compressor 110. In one embodiment, the pressure of the internal fluid is greatest within the cycle through the cooling system within or upon exiting the compressor 110. The fluid moves through the conduit 116A to the second air-cooled condenser 108 b. The temperature of the fluid may be reduced again by the second air-cooled condenser 108 b. The higher pressure and lower temperature of the fluid exits the second air-cooled condenser 108 b into the conduit 116B and optionally enters the expansion valve 120. While in or moving through the expansion valve 120, the pressure of the fluid may be decreased. The fluid pressure may decrease without changing the phase of the fluid in one embodiment. The reduced pressure, reduced temperature fluid then flows into the heat exchanger 104 via the conduit 112B, where the cooling cycle of the cooling system begins again.

The various components of the cooling system 100, and particularly those that facilitate the transfer and/or exchange of heat energy, such as the heat exchanger 104 and the condenser devices 108, may be constructed of materials that are substantially resistant to wear, heat, cold, high and low pressure, corrosion, and chemical or flow related damage while maintaining appropriate levels of heat transfer capabilities. Various components of the cooling system 100, especially those comprised of different materials, may be isolated from each other as well as their operational environment as needed or desired. Appropriate materials for constructing the various components of the cooling system 100 may include, for example and without limitation, carbon steel, stainless steel, copper-nickel, aluminum, other metals and/or alloys, high density plastics, other polymers, including any combination thereof. Some or all the components of the cooling system 100 may be implemented multiple times or not at all. By way of example and not limitation, in some instances, the cooling system 100 may comprise two heat exchangers 104, four condenser devices 108, no expansion valve 120, etc.

Being that the cooling system 100 may not, in some aspects, require any water to function, fouling and scaling of the various components of the cooling system 100 in such aspects may generally not be issues. Additionally, with proper installation and maintenance practices, corrosion may be minimized and/or prevented within the various components of the cooling system 100. By having no need for auxiliary electrical input, no need for water treatment procedures, and by having relatively few moving components, operational maintenance costs associated with the cooling system 100 may be relatively low and the cooling system 100 may therefore be relatively efficient in use. Additionally, the cooling system 100 may be used in a wide variety of locations and/or climates without having to be concerned with water availability, water restrictions, and/or water usage or water consumption regulations. Furthermore, given that the cooling system 100 may not be required to be associated with one or more cooling towers, thermoelectric power plants that may utilize the cooling system 100 may be relatively safe in that the risk of cooling tower collapse and/or fire is reduced or negated altogether.

FIG. 2 illustrates another cooling system 200. The cooling system 200 may have several of the same components, connections, arrangements, and the like, as the cooling system 100 shown in FIG. 1. One difference is the addition of at least one second heat exchange mechanism, such as, by way of example, a stack heat recovery steam generator (HRSG stack heat) apparatus 202. The HRSG stack heat apparatus 202 may be include one or more heat exchange devices, such as an energy recovery heat exchange device or similar apparatus. The HRSG stack heat apparatus 202 captures or recovers an amount of heat energy from one or more heat sources 102 and provides at least one portion of the captured or recovered heat to the internal fluid within cooling system 200. This can further increase the temperature of the internal fluid before the internal fluid enters the expander 106. As a result of this temperature increase, the enthalpy of the internal fluid may also be raised. As another example, the HRSG apparatus 202 can be a lube oil cooler, waste steam heater, or the like.

By increasing the temperature and enthalpy of the internal fluid before the internal fluid enters the expander 106, more energy may be generated by the expander 106 when the internal fluid is allowed to expand therein. This, in turn, may allow for more power to be provided to the condenser devices 108, the compressor 110, and/or any other component(s) of the cooling system 200 (or to applications external from the cooling system 200). This can allow the condenser devices 108 and/or the compressor 110 to function at increased capacity levels and/or allow the condenser devices 108 and/or compressor 110 include comprise more powerful configurations (e.g., by using larger fan motors in the condenser devices 108, etc.). This can increase the overall cooling effect provided by the cooling system 200, increase the efficiency of cooling system 200, and/or increase the net energy output that may be generated by the cooling system 200 via the functioning of the expander 106.

This configuration may allow the cooling system 200 to have a greater cooling capacity that may be particularly useful in climates that have especially high temperatures that make cooling processes more difficult and, due to the high usage of air conditioning devices, may cause more power generation to be needed (and therefore may cause more heat to be produced) by any power generation facilities that may be associated with the cooling system 200. The heat source(s) 102 that may provide heat energy to HRSG stack heat apparatus 202 may include an external heat source, one or more components and/or processes associated with cooling system 200 itself, heat from steam (such as that produced by one or more boilers associated with a thermoelectric power plant), heat from one or more turbine exhaust gases, heat from one or more boiler exhaust gasses, as well as any other appropriate heat source(s) 102.

While an expansion valve 120 is shown in the cooling system 200, alternatively, the cooling system 200 may not include the expansion valve 120 or any other expansion valve. For example, the second air-cooled condenser 108 b may be coupled with the heat exchanger 104 by conduits 112 and/or 116 without the expansion valve 120 being between the second air-cooled condenser 108 b and the heat exchanger 104.

In operation, the internal fluid absorbs thermal energy (e.g., heat) 102 b from the heat source 102 as the fluid is located in and/or moving through the heat exchanger 104. The pressure and/or temperature of the internal fluid increases and some or all the fluid may change phase (e.g., to a supercritical state or to a vapor state) before or while moving through the conduit 112A to the HRSG stack heat exchanger 202. The HRSG stack heat exchanger 202 is separate from the heat exchanger 104, but may transfer additional heat from the same heat source 102 as the heat exchanger 104 and/or heat from another heat source 102 to the fluid passing through the HRSG stack heat exchanger 202. The temperature of the fluid may be again increased while passing through the HRSG stack heat exchanger 202. For example, the fluid temperature may be increased from a first low temperature (and low pressure) upon entering and/or passing through the heat exchanger 104 to a second, greater temperature (and, optionally, a greater pressure). The fluid temperature may then be increased again (e.g., to a third, greater temperature and optionally an even greater pressure) during passage through and/or exit from the HRSG stack heat exchanger 202. The fluid may change phases during and/or after flowing through the heat exchanger 104 and/or HRSG stack heat exchanger 202 (e.g., to a supercritical or vapor phase).

The fluid may then move through the conduit 112B to the expander 106. The fluid expands within the expander 106 to at least partially reduce the pressure and/or temperature of the fluid. The temperature and/or pressure can be reduced, but not to the pressure and/or temperature of the fluid prior to entering the heat exchanger 104 from the conduit 112C. At least some electric current can be generated by expansion of fluid in the expander 106. At least part, but not all, of the fluid can change phases in or upon exiting the expander 106 to a liquid (from the supercritical or vapor state) or may stay in the same supercritical or vapor state upon exiting the expander 106. The fluid then moves through the conduit 114A to the first air-cooled condenser 108 a, where the fluid is cooled and changes phase to a liquid state (e.g., all or the remaining part of the fluid that is not in the liquid state changes to the liquid state). At least some of the electric current generated by fluid passing through the expander 106 may be used to power the first air-cooled condenser 108 a.

The liquid internal fluid then moves through the conduit 114B to the compressor 110. The pressure of the internal fluid is then increased by the compressor 110. In one embodiment, the pressure of the internal fluid is greatest within the cycle through the cooling system within or upon exiting the compressor 110. The fluid moves through the conduit 116A to the second air-cooled condenser 108 b. The temperature of the fluid may be reduced again by the second air-cooled condenser 108 b. The higher pressure and lower temperature of the fluid exits the second air-cooled condenser 108 b into the conduit 116B and optionally enters the expansion valve 120. While in or moving through the expansion valve 120, the pressure of the fluid may be decreased. The fluid pressure may decrease without changing the phase of the fluid in one embodiment. The reduced pressure, reduced temperature fluid then flows into the heat exchanger 104 via the conduit 112C, where the cooling cycle of the cooling system begins again.

FIG. 3 illustrates a flowchart of one embodiment of a cooling process 300. The cooling process 300 can represent operations performed using the cooling system 100 shown in FIG. 1 or another cooling system. The process 300 may be used to remove an amount of heat energy from at least one heat source 102. In some embodiments, the process 300 may be used to provide a cooling effect to at least one power generation facility such as, for example and not limitation, a thermoelectric power plant; one or more pieces of IT equipment, such as, by way of example and not limitation, one or more computer servers in one or more data centers; or any facility, business, residence, structure, process, system, piece of equipment, enclosure, substance, location, or the like, as well as any combination thereof.

At 304, the internal fluid absorbs heat energy transferred to the fluid from the one or more heat sources 102 and may thereby experience an increase in temperature and enthalpy while at least partially cooling the heat source(s) 102. The internal fluid (which may, in some nonlimiting example embodiments, begins at a state of relatively moderate pressure or any other appropriate pressure state) may absorb heat energy via the heat exchanger 104. Additionally or alternatively, the heat source(s) 102 may provide heat energy in the form of heat generated by the operation of cooling system 100, from an external power source, or from any other appropriate source(s). After being heated, the moderate pressure internal fluid may be taken to at least one expanding device, such as the expander 106, via at least one section of moderate pressure conduits 112 a and, if relevant, the cooled incoming heat (such as steam which may be condensed to form water), may be sent back to one or more boilers associated with a thermoelectric power plant to be reheated to form more steam.

At 306, the internal fluid may be allowed to expand via at least one expander 106. This can alter the internal fluid from a relatively moderate pressure state to a relatively low pressure state (or, in some aspects, from a relatively high pressure state to a relatively low pressure state, or, in some additional aspects, from a relatively high pressure state to a relatively moderate pressure state). In some aspects, this change in pressure state may occur in a relatively short amount of time. This relatively quick decrease in pressure state may facilitate the generation of mechanical energy while resulting in a decrease in the temperature of the internal fluid. At least one portion of the generated mechanical energy may be captured and converted to an energy form useable to power one or more components of the cooling system 100, such as, for example and not limitation, one or both condenser devices 108 and/or the compressor 110 (not shown in FIG. 3), such energy form typically being either electrical or mechanical. The energy form conversion may be facilitated by one or more energy conversion mechanisms, such as, for example and not limitation, one or more mechanical power transmission devices and/or techniques, at least one electric generator and/or motor in circuit, or any other appropriate means or device(s).

By way of example, at least one portion of the captured and converted energy may be transferred to the condenser device(s) 108 and/or the compressor 110 via at least one section of the power supply connections 118, or via any other appropriate means. At least one portion of the energy that is generated in excess of what is required by the condenser device(s) 108 and/or the compressor 110 may be stored for later use. Optionally, a portion of this energy can be transferred to other components of the cooling system 100 via at least one section of the power supply connectivity 118 to provide power thereto. Optionally, a portion of this energy can be converted to electricity by one or more generators or similar devices or apparatus for uses external from the cooling system 100. Optionally, a portion of this energy can be used to power one or more components of a thermoelectric power plant. Optionally, a portion of this energy can be used to power one or more pieces of IT equipment (e.g., one or more computer servers in one or more data centers). Optionally, a portion of this energy can be used to power another component(s) of any facility, business, residence, structure, process, or the like. Optionally, a portion of this energy can be distributed and/or sold to one or more power companies associated with one or more electrical grids. Optionally, a portion of this energy can be used for any other appropriate purpose. After the expansion of the internal fluid has been completed, the expanded internal fluid may be transported to a first at least one condenser device 108 a, such as a first air-cooled condenser, via at least one section of low pressure conduits 114 a.

At 308, at least one portion of the heat energy is removed from the internal fluid and the internal fluid experiences a temperature drop. This decrease in temperature may facilitate the ability of the cooling system 100 to dissipate heat from the internal fluid and may make it easier for the compressor 110 to later compress the internal fluid by requiring less energy to perform the compression. In some aspects, the lost heat energy may be dissipated to at least one external body. By way of example and not limitation, external bodies capable of receiving heat from the internal fluid may include ambient air, fluid(s)/gas(es) utilized by other systems and/or processes, internal fluid within other portions of the cooling system 100, any type of heat sink, a large body of water, or any other appropriate heat receiving element(s). The internal fluid may or may not come in direct contact with the heat receiving external body or bodies at some point.

In some additional aspects, at least one portion of the heat dissipated from the internal fluid may be captured and used for purposes external from the cooling system 100, or the heat may be captured and used as a heat source 102 for the cooling system 100, particularly for use by the heat exchanger 104. By way of example and not limitation, the heat loss from the internal fluid may be facilitated by first at least one condenser device 108 a, which may comprise any appropriate configuration such as, by way of example and not limitation, an air-cooled condenser. In some aspects, the first condenser device 108 a may be at least partially powered by at least one portion of the energy generated by the expander 106 at 306 and transferred to the first condenser device 108 a via at least one energy transmission system, such as, by way of example and not limitation, at least one section of power supply connection 118, as well as via any other appropriate mechanical and/or electrical energy transfer means or technique(s). Once an appropriate amount of heat has been removed from the internal fluid, it may be taken from the first condenser device 108 a to at least one compressor device, such as the compressor 110, via at least one section of low pressure conduits 114 b.

At 310, the internal fluid experiences an increase in pressure as the fluid gets compressed and is thereby altered from a relatively low pressure state to a relatively high pressure state (or, in some aspects, from a relatively moderate pressure state to a relatively high pressure state, or, in some additional aspects, from a relatively low pressure state to a relatively moderate pressure state) via at least the compressor 110. This change in pressure state may occur in a relatively short amount of time.

Increasing the pressure of the internal fluid may allow for more energy to be generated when the fluid enters the expander 106. This increase in pressure may simultaneously cause the temperature of the internal fluid to increase. In some aspects, the compressor 110 may be at least partially powered by at least one portion of the energy generated by the expander 106 at 306 and transferred to the compressor 110 via at least one energy transmission system, such as at least one section of power supply connections 118. Once the internal fluid has been compressed, the fluid may be taken from the compressor 110 to a second condenser device 108 b, such as a second air-cooled condenser, via at least one section of high pressure conduits 116 a.

At 312, at least one portion of the heat energy is removed from the internal fluid and the internal fluid experiences a temperature drop. This decrease in temperate may allow the fluid to absorb more heat energy when the fluid re-enters the heat exchanger 104, as shown in FIG. 1. The lost heat energy may be dissipated to at least one external body, as described above. At least one portion of the heat dissipated from the internal fluid may be captured and used for purposes external from the cooling system 100 and/or may be captured and used as a heat source 102 for the cooling system 100 (e.g., for use by the heat exchanger 104). The heat loss from the internal fluid may be facilitated by the second condenser device 108 b (e.g., an air-cooled condenser). Once at least some of the heat has been removed from the high pressure internal fluid, the fluid may be taken to at least one expansion valve 120 via at least one section of high pressure conduits 116 b.

At 314, the internal fluid may be allowed to expand within at least one expansion valve 120, thereby being altered from a relatively high pressure state to a relatively moderate pressure state (or, in some aspects, from a relatively high pressure state to a relatively low pressure state, or, in some additional aspects, from a relatively moderate pressure state to a relatively low pressure state). This decrease in pressure may simultaneously or concurrently cause the temperature and enthalpy of the internal fluid to decrease. By decreasing the temperature and enthalpy of the internal fluid before the fluid enters the heat exchanger 104 (or any other appropriate heat exchange device(s)), the internal fluid may be able to absorb more heat energy from one or more heat sources 102 that may interact with the internal fluid, either directly or indirectly. Additionally, lowering the pressure of the internal fluid may allow for improved functioning of the heat exchanger 104 (or any other appropriate heat exchange device(s)) and/or may reduce damage thereto.

The process 300 may repeat one or more times. For example, flow of the process 300 may return toward 304. Alternatively, the process 300 may terminate. A determination of whether to repeat the process 300 may be made by a user of cooling system 100 or by one or more computing devices communicatively coupled to cooling system 100, either wirelessly or via wired connectivity, either directly or via one or more networks (such as the global public Internet or a private intranet network or local area network). Typically, if more cooling is to be performed, then process 300 will be continued until the cooling effects of process 300 are no longer required and/or until timing and/or environmental conditions warrant the stoppage of process 300. If it is determined that process 300 should be repeated, then process 300 proceeds back to 304 to begin another cooling cycle, whereby the moderate pressure (or any appropriate pressure state) internal fluid may be taken by moderate pressure conduits 112 b to heat exchanger 104 where the fluid may absorb more heat energy. If it is determined that process 300 should not be repeated, then process 300 may end.

FIG. 4 illustrates a flowchart of another cooling process 400. The process 400 may represent one or more operations performed by the cooling system 200 shown in FIG. 2 or another cooling system to remove heat energy from at least one heat source 102 such as a thermoelectric power plant; one or more pieces of IT equipment; or any facility, business, residence, structure, process, system, piece of equipment, enclosure, substance, location, or the like.

At 404, the internal fluid absorbs heat energy transferred to the fluid from one or more heat sources 102 and may experience an increase in temperature and enthalpy. This can at least partially cool the heat source(s) 102. The internal fluid may absorb heat energy via one or more heat exchange devices such as the heat exchanger 104. After being heated, the moderate pressure internal fluid may be taken to at least one additional heat exchange device, such as HRSG stack heat apparatus 202 via at least one section of moderate pressure conduits 112 a. Optionally, the cooled incoming heat (such as steam which may be condensed to form water), may be sent back to one or more boilers associated with a thermoelectric power plant to be reheated to form more steam.

At 406, an additional amount of heat energy may be added to the internal fluid as the fluid absorbs additional heat energy from one or more additional heat sources 102 via one or more additional heat exchange devices (e.g., the HRSG stack heat apparatus 202) and thereby experiences a further increase in temperature and enthalpy. The additional heat source(s) 102 may or may not be the same heat source(s) 102 utilized at 404. The heat source(s) 102 that may provide heat energy to HRSG stack heat apparatus 202 may include an external heat source, one or more components and/or processes associated with cooling system 200 itself, heat from steam (such as that produced by one or more boilers associated with a thermoelectric power plant), heat from one or more turbine exhaust gases, heat from one or more boiler exhaust gasses, as well as any other appropriate heat source(s) 102. Adding at least one additional heat exchange device to cooling system 200 may enable cooling system 200 to be more effective at removing more heat from heat source(s) 102. Furthermore, by further increasing the temperature and enthalpy of the internal fluid before the fluid enters an expanding device (e.g., the expander 106), cooling system 200 may be able to generate more mechanical energy once the internal fluid is allowed to expand. Once the internal fluid has absorbed a sufficient amount of heat energy, the fluid may be taken to one or more expanding devices, such as expander 106, via at least one section of moderate pressure conduits 112 b.

At 408, the internal fluid may be allowed to expand via at least one expanding device, such as the expander 106. This alters the fluid from a relatively moderate pressure state to a relatively low pressure state (or, in some aspects, from a relatively high pressure state to a relatively low pressure state, or, in some additional aspects, from a relatively high pressure state to a relatively moderate pressure state). In some aspects, this change in pressure state may occur in a relatively short amount of time. This relatively quick decrease in pressure state may facilitate the generation of mechanical energy while resulting in a decrease in the temperature of the internal fluid.

At least one portion of the generated mechanical energy may be captured and converted to an energy form useable to power one or more components of cooling system 200, as described above. After the expansion of the internal fluid has been completed, the expanded internal fluid may be transported to a first at least one condenser device 108 a, such as a first air-cooled condenser, via at least one section of low pressure conduits 114 a.

At 410, at least one portion of the heat energy is removed from the internal fluid and the internal fluid thereby experiences a temperature drop. This decrease in temperature may facilitate the ability of cooling system 200 to dissipate heat from the internal fluid and may make it easier for compressor 110 to later compress the internal fluid by requiring less energy to perform the compression. In some aspects, the lost heat energy may be dissipated to at least one external body. By way of example and not limitation, external bodies capable of receiving heat from the internal fluid may include ambient air, fluid(s)/gas(es) utilized by other systems and/or processes, internal fluid within other portions of cooling system 200, any type of heat sink, a large body of water, or any other appropriate heat receiving element(s). The internal fluid may or may not come in direct contact with the heat receiving external body or bodies at some point.

At least one portion of the heat dissipated from the internal fluid may be captured and used for purposes external from cooling system 200, or the heat may be captured and used as a heat source for cooling system 200, particularly for use by heat exchanger 104 and/or HRSG stack heat apparatus 202. The heat loss from the internal fluid may be facilitated by first condenser device 108 a, such as an air-cooled condenser. The first condenser device 108 a may be at least partially powered by at least one portion of the energy generated by expander 106 at 408 and transferred to first condenser device 108 a via at least one energy transmission system, such as at least one section of power supply connections 118. The fluid may be taken from the first condenser device 108 a to at least one compressor device, such as compressor 110, via at least one section of low pressure conduits 114 b.

At 412, the internal fluid experiences an increase in pressure as the fluid gets compressed and is thereby altered from its relatively low pressure state to a relatively high pressure state (or, in some aspects, from a relatively moderate pressure state to a relatively high pressure state, or, in some additional aspects, from a relatively low pressure state to a relatively moderate pressure state) via at least one compressor device, such as the compressor 110. This change in pressure state may occur in a relatively short amount of time. Increasing the pressure of the internal fluid may allow for more energy to be generated when the fluid enters expander 106. This increase in pressure may simultaneously cause the temperature of the internal fluid to increase. Once the internal fluid has been compressed, the fluid may be taken from compressor 110 to a second condenser device 108 b, such as a second air-cooled condenser, via at least one section of high pressure conduits 116 a.

At 414, at least one portion of the heat energy is removed from the internal fluid and the internal fluid thereby experiences a temperature drop. This decrease in temperate may allow the internal fluid to absorb more heat energy when the fluid enters heat exchanger 104. In some aspects, the lost heat energy may be dissipated to at least one external body. By way of example and not limitation, external bodies capable of receiving heat from the internal fluid may include ambient air, fluid(s)/gas(es) utilized by other systems and/or processes, internal fluid within other portions of cooling system 200, any type of heat sink, a large body of water, or any other appropriate heat receiving element(s). The internal fluid may or may not come in direct contact with the heat receiving external body or bodies at some point. At least one portion of the heat dissipated from the internal fluid may be captured and used for purposes external from cooling system 200, or the heat may be captured and used as a heat source for cooling system 200, particularly for use by heat exchanger 104 and/or HRSG stack heat apparatus 202.

The heat loss from the internal fluid may be facilitated by second condenser device 108 b, such as an air-cooled condenser. In some aspects, second condenser device 108 b may be at least partially powered by at least one portion of the energy generated by expander 106 at 408 and transferred to second condenser device 108 b via at least one energy transmission system, such as at least one section of power supply connections 118. Once at least some of the heat has been removed from the high pressure internal fluid, the fluid may be taken to at least one expansion valve 120 via at least one section of high pressure conduits 116 b.

At 416, the internal fluid may be allowed to expand via at least one expansion valve 120, thereby being altered from a relatively high pressure state to a relatively moderate pressure state (or, in some aspects, from a relatively high pressure state to a relatively low pressure state, or, in some additional aspects, from a relatively moderate pressure state to a relatively low pressure state). This change in pressure state may occur in a relatively short amount of time. This decrease in pressure may simultaneously cause the temperature and enthalpy of the internal fluid to decrease.

By decreasing the temperature and enthalpy of the internal fluid before the fluid enters heat exchanger 104 (or any other appropriate heat exchange device(s)), the internal fluid may be able to absorb more heat energy from one or more heat sources 102 that may interact with the internal fluid, either directly or indirectly. Additionally, lowering the pressure of the internal fluid may allow for improved functioning of heat exchanger 104 (or any other appropriate heat exchange device(s)) and/or may minimize or reduce damage thereto.

The process 400 may repeat one or more times. For example, flow of the process 400 may return toward 404. Alternatively, the process 400 may terminate. A determination of whether to repeat the process 400 may be made by a user of cooling system 200 or by one or more computing devices communicatively coupled to cooling system 200, either wirelessly or via wired connectivity, either directly or via one or more networks (such as the global public Internet or a private intranet network or local area network). Typically, if more cooling is to be performed, then process 400 will be continued until the cooling effects of process 400 are no longer required and/or until timing and/or environmental conditions warrant the stoppage of process 400. If it is determined that process 300 should be repeated, then process 400 proceeds back to 404 to begin another cooling cycle, whereby the moderate pressure (or any appropriate pressure state) internal fluid may be taken by moderate pressure conduits 112 b to heat exchanger 104 where the fluid may absorb more heat energy. If it is determined that process 400 should not be repeated, then process 400 may end.

It is noted that the order of the operations of processes 300 and 400, including the starting and/or ending points thereof, may be altered. The various operations of processes 300 and 400 may be repeated and/or omitted to accommodate variations of cooling systems 100 and 200 that have repeated and/or omitted components (e.g., operations 314 and 416 may be omitted in embodiments wherein cooling systems 100 and 200, respectively, may not comprise an expansion valve 120).

Each of FIGS. 5, 6, 7, and 8 illustrates another cooling system 600, 700, 800, 900. The cooling systems 600, 700, 800, 900 may include the heat exchanger 104, the expander 106, the compressor 110, and one or more of the conduits 114, 116 described above. The cooling systems 600, 700, 800, 900 also include a condenser 608, which can represent one or more of the condensers 108 a, 108 b described above. Optionally, the condenser 608 may represent a water-cooled condenser or another type of condenser. The condenser 608 may facilitate the dissipation of heat from the internal fluid passing through it to a space and/or object outside of the cooling systems 600, 700, 800, 900. One or more of the cooling systems 600, 700, 800, 900 may include additional numbers of any of these components in order to alter its performance and/or efficiency.

The internal fluid may be contained within the cooling systems 600, 700, 800, 900 and may travel to the various components thereof via the conduits 114, 116, as shown in FIGS. 5 through 8. As described herein, the internal fluid may comprise one or more liquids, gases, or supercritical fluids, or any combination thereof. For example, the internal fluid may comprise halocarbons, water, supercritical carbon dioxide, or any other appropriate fluid as may be apparent to those skilled in the relevant art(s) after reading the description herein.

The cooling systems 600, 700 shown in FIGS. 5 and 6 also include a heat pump 604. The heat pump 604 moves heat from a medium of relatively low temperature to a medium of relatively high temperature (e.g., the opposite of spontaneous heat flow). The heat pump 604 may remove heat from the internal fluid right before the fluid enters the compressor 110. This reduces the amount of energy needed to adjust the internal fluid from the relatively low pressure state of the fluid to the relatively high pressure state of the fluid. Similarly, the same heat pump 604 also may be configured to add heat to the internal fluid right before the fluid enters the expander 106. This can increase the amount of mechanical energy generated by the expander 106 when the internal fluid is adjusted from the relatively high pressure state to the relatively low pressure state of the fluid. The heat pump can transfer or otherwise move the heat from the fluid heading into the compressor 110 to the fluid heading into the expander 106. The heat pump 604 may be powered by sources internal to the cooling systems 600, 700, such as power generated by the cooling systems 600, 700 and/or sources external to the cooling systems 600, 700.

The cooling systems 600, 800 shown in FIGS. 5 and 7 also may include a regenerator 610. The regenerator 610 may be a heat exchange device in a tube and shell format, a plate format, a direct contact format, or in another configuration. The regenerator 610 optionally can be referred to as a regenerative heat exchanger. The regenerator 610 may move heat energy from internal fluid that is in the relatively high pressure state within the high pressure conduit 114 to the internal fluid that is in the relatively low pressure state within the low pressure conduit 116, as shown in FIGS. 5 and 7. The regenerator 610 may perform this function without requiring the internal fluid within high pressure conduit 114 to come in direct contact with the internal fluid within the low pressure conduit 116. The regenerator 610 may be positioned to perform these tasks after the internal fluid has left the compressor 110 and the expander 106, when the fluid is at a relatively cool and relatively warm temperature, respectively. By mitigating such temperature differences, the regenerator 610 may help reduce the amount of heat energy transfer needed within the heat exchanger 104 and the condenser 608. This can assist the cooling system 600, 800 in functioning more efficiently and reducing the necessary sizes of the heat exchanger 104 and the condenser 112, allowing systems 500, 700 to require less space in which to be installed as well as requiring a lower manufacturing cost.

In selecting the internal fluid for use in the cooling systems described herein, it may be beneficial to select an internal fluid that allows for more energy to be generated by the expander 106 than is required by the compressor 110, thereby allowing for the cooling systems to be at least partially self-powered and able to perform a self-cooling effect. The heat exchanger 104, heat pump 604, regenerator 610, and condenser 108, 608 may be of such appropriate sizes so as to allow for the necessary thermodynamic states of the selected internal fluid that allow the cooling systems to function.

The various components of the cooling systems described herein, and particularly those components that facilitate the transfer and/or exchange of heat energy, such as the heat exchanger 104, heat pump 604, regenerator 610, and condenser 108, 608, may be constructed of materials that are substantially resistant to wear, corrosion, and chemical or flow related damage while maintaining appropriate levels of heat transfer capabilities. Various components of the cooling systems, especially those comprised of different materials, may be isolated from each other as well as their operational environment as needed or desired. Appropriate materials for constructing the various components of the cooling systems may include carbon steel, stainless steel, copper-nickel, aluminum, other metals and/or alloys, high density plastics, other polymers, as well as other materials. Some or all of the components of the cooling systems may be used repeatedly. By way of example and not limitation, the cooling systems may comprise two heat exchangers, three heat pumps, etc.

The arrows shown in the conduits 114, 116 can represent the direction of flow of the fluid through the cooling systems. The terms downstream and upstream can indicate where different components are located along the flow path of the fluid. A first component that is directly downstream of a second component may receive the fluid from the second component without the fluid passing through any other component other than conduits.

As shown, different cooling systems 600, 700, 800, 900 include different combinations and/or arrangements of the components. With respect to the cooling system 600 shown in FIG. 5, the internal fluid passes through the heat exchanger 104 and absorbs heat from the heat source. The temperature and optionally pressure of the fluid is increased, and the phase of the internal fluid may change (e.g., to a supercritical and/or vapor phase). The heated fluid moves through the conduit 114 to and through the heat pump 604. The heat pump 604 may further heat the fluid by transferring heat from another portion of the fluid moving through the heat pump 604 (e.g., through the conduits 116 from the condenser 608 to the compressor 110). Stated differently, after being heated by the heat from the heat source via the heat exchanger 104, the fluid may again be heated by the heat pump 604 before flowing into the conduit 116 to the expander 106. This additional heating by the heat pump 604 may change the phase of the fluid or a remainder of the fluid. For example, all or substantially all (e.g., at least 95%) of the fluid may be in the supercritical phase upon exiting the pump 604. Alternatively, the heat pump 604 may further heat the fluid without changing the phase of the fluid.

The heated fluid flows through the conduit 116 from the heat pump 604 to the expander 106. The expander 106 can decrease the pressure of the fluid, as described herein. The phase of the fluid may change due to this decrease in pressure. For example, more or the remainder of the fluid may change to the supercritical or vapor phase. Alternatively, the phase of the fluid may not change due to or during passage through the expander 106. The high temperature, lower pressure fluid then moves through the conduit 116 to the regenerator 610. The regenerator 610 can further heat this fluid from thermal energy or heat from another portion of the fluid. For example, the regenerator 610 can transfer heat from (a) a portion of the fluid moving from the compressor 110 to the heat exchanger 104 via the conduits 114 and the regenerator 610 to (b) a different portion of the fluid moving from the expander 106 to the condenser 608 via the conduits 116 and the regenerator 610. The even higher temperature, lower pressure portion of the fluid that entered the regenerator 610 from the expander 106 may then flow to the condenser 608 via the conduit 116.

The condenser 608 can reduce the temperature of the lower pressure fluid. This can change the phase of the fluid (e.g., to a liquid or more liquid state) than the fluid exiting the regenerator 610. The fluid can then flow through the conduit 116 to the heat pump 604. This portion of the fluid can then be further cooled by the heat pump 604 transferring heat to another portion of the fluid (that is flowing from the heat exchanger 104 to the expander 106), as described above. The cooled, low pressure fluid exiting the heat pump 604 then flows to the compressor 110 via the conduit 116. The compressor 110 increases the pressure of the fluid. The fluid can then flow to the regenerator 610 via the conduit 114. As described above, this portion of the fluid can be cooled by the regenerator 610 transferring heat from the fluid to another portion of the fluid (e.g., that is flowing through the regenerator 610 from the expander 106 to the condenser via the conduits 116). The portion of the fluid exiting the regenerator 610 can then flow into the heat exchanger 104, where the cooling cycle of the cooling system 600 can begin again.

With respect to the cooling system 700 shown in FIG. 6, the internal fluid passes through the heat exchanger 104 and absorbs heat from the heat source. The temperature and optionally pressure of the fluid is increased, and the phase of the internal fluid may change (e.g., to a supercritical and/or vapor phase). The heated fluid moves through the conduit 114 to and through the heat pump 604. The heat pump 604 may further heat the fluid by transferring heat from another portion of the fluid moving through the heat pump 604 (e.g., through the conduits 116 from the condenser 608 to the compressor 110). Stated differently, after being heated by the heat from the heat source via the heat exchanger 104, the fluid may again be heated by the heat pump 604 before flowing into the conduit 116 to the expander 106. This additional heating by the heat pump 604 may change the phase of the fluid or a remainder of the fluid. For example, all or substantially all (e.g., at least 95%) of the fluid may be in the supercritical phase upon exiting the pump 604. Alternatively, the heat pump 604 may further heat the fluid without changing the phase of the fluid.

The heated fluid flows through the conduit 116 from the heat pump 604 to the expander 106. The expander 106 can decrease the pressure of the fluid, as described herein. The phase of the fluid may change due to this decrease in pressure. For example, more or the remainder of the fluid may change to the supercritical or vapor phase. Alternatively, the phase of the fluid may not change due to or during passage through the expander 106. The high temperature, lower pressure fluid then moves through the conduit 116 to the condenser 608 via the conduit 116.

The condenser 608 can reduce the temperature of the lower pressure fluid. This can change the phase of the fluid (e.g., to a liquid or more liquid state) than the fluid exiting the expander 106. The fluid can then flow through the conduit 116 to the heat pump 604. This portion of the fluid can then be further cooled by the heat pump 604 transferring heat to another portion of the fluid (that is flowing from the heat exchanger 104 to the expander 106), as described above. The cooled, low pressure fluid exiting the heat pump 604 then flows to the compressor 110 via the conduit 116. The compressor 110 increases the pressure of the fluid. The fluid can then flow to the heat exchanger 104 via the conduit 114, where the cooling cycle of the cooling system 700 can begin again.

With respect to the cooling system 800 shown in FIG. 7, the internal fluid passes through the heat exchanger 104 and absorbs heat from the heat source. The temperature and optionally pressure of the fluid is increased, and the phase of the internal fluid may change (e.g., to a supercritical and/or vapor phase). The heated fluid moves through the conduit 114 to the expander 106. All or substantially all (e.g., at least 95%) of the fluid may be in the supercritical phase upon exiting the heat exchanger 104.

The expander 106 can decrease the pressure of the fluid, as described herein. The phase of the fluid may change due to this decrease in pressure. For example, more or the remainder of the fluid may change to the supercritical or vapor phase. Alternatively, the phase of the fluid may not change due to or during passage through the expander 106. The high temperature, lower pressure fluid then moves through the conduit 116 to the regenerator 610. The regenerator 610 can further heat this fluid from thermal energy or heat from another portion of the fluid. For example, the regenerator 610 can transfer heat from (a) a portion of the fluid moving from the compressor 110 to the heat exchanger 104 via the conduits 114 and the regenerator 610 to (b) a different portion of the fluid moving from the expander 106 to the condenser 608 via the conduits 116 and the regenerator 610. The even higher temperature, lower pressure portion of the fluid that entered the regenerator 610 from the expander 106 may then flow to the condenser 608 via the conduit 116.

The condenser 608 can reduce the temperature of the lower pressure fluid. This can change the phase of the fluid (e.g., to a liquid or more liquid state) than the fluid exiting the regenerator 610. The fluid can then flow through the conduit 116 to the compressor 110. The compressor 110 increases the pressure of the fluid. The fluid can then flow to the regenerator 610 via the conduit 114. As described above, this portion of the fluid can be cooled by the regenerator 610 transferring heat from the fluid to another portion of the fluid (e.g., that is flowing through the regenerator 610 from the expander 106 to the condenser via the conduits 116). The portion of the fluid exiting the regenerator 610 can then flow into the heat exchanger 104 via the conduit 114, where the cooling cycle of the cooling system 800 can begin again.

With respect to the cooling system 900 shown in FIG. 8, the internal fluid passes through the heat exchanger 104 and absorbs heat from the heat source. The temperature and optionally pressure of the fluid is increased, and the phase of the internal fluid may change (e.g., to a supercritical and/or vapor phase). The heated fluid moves through the conduit 114 to the expander 106. The expander 106 can decrease the pressure of the fluid, as described herein. The phase of the fluid may change due to this decrease in pressure. For example, more or the remainder of the fluid may change to the supercritical or vapor phase. Alternatively, the phase of the fluid may not change due to or during passage through the expander 106. The high temperature, lower pressure fluid then moves through the conduit 116 to the condenser 608. The condenser 608 can reduce the temperature of the lower pressure fluid. This can change the phase of the fluid (e.g., to a liquid or more liquid state) than the fluid exiting the expander 106. The fluid can then flow through the conduit 116 to the compressor 110. The compressor 110 increases the pressure of the fluid. The fluid can then flow back into the heat exchanger 104 via the conduit 114, where the cooling cycle of the cooling system 900 can begin again.

FIG. 9 illustrates a flowchart of a cooling process 1000. The cooling process 1000 can represent operations performed by one or more of the cooling systems described herein. At 1004, a heat exchanger takes in heat from a heat source and adds the heat to a relatively high pressure internal fluid. After being heated, the high pressure internal fluid is taken to a heat pump via high pressure conduits. At 1006, more heat is added to the high pressure internal fluid via a heat pump. This heat may come from the heat generated by the operation of the cooling system, from heat previously removed from relatively low pressure internal fluid at the inlet of a compressor, from an external power source, or another source. Heating the high pressure internal fluid as much as possible before entering an expander may allow for more energy to be generated by the internal fluid upon being expanded within expander. Once the high pressure internal fluid has been sufficiently heated, the fluid is taken to expander via high pressure conduits.

At 1008, the internal fluid within the expander is expanded and is thereby altered from a relatively high pressure state to a relatively low pressure state in a relatively short amount of time. This can generate mechanical energy while lowering the temperature of the internal fluid. This mechanical energy may be converted to an energy form capable of powering a compressor, either electrical or mechanical. Such conversion may be facilitated by mechanical transmission techniques, an electric generator and/or motor in circuit, or the like. Energy that is generated in excess of what is required by the compressor may be stored for later use, transferred to other components of the cooling system, converted to electricity by one or more generators for uses external from cooling systems, or used for another purpose. After the expansion of the internal fluid has been completed, the expanded low pressure internal fluid may be transported to regenerator via low pressure conduits.

At 1010, the regenerator transfers heat from the low pressure internal fluid in low pressure piping to the high pressure internal fluid in high pressure piping. This helps mitigate the temperature difference between the relatively hot low pressure fluid coming from the expander and the relatively cool high pressure fluid coming from the compressor. This helps reduce the amount of heat transfer required to be performed by the heat exchanger and condenser, which serves to increase the overall operational efficiency of the cooling system. Upon leaving the regenerator, the lower pressure internal fluid may be taken by the low pressure conduit to the condenser.

At 1012, heat is transferred from the low pressure internal fluid to an external body and/or space by a condenser, thereby lowering the temperature of the internal fluid. In some aspects, the heat dissipated by condenser is captured and supplied to other portions of the cooling system for later use, such as for a heat pump. Once an appropriate amount of heat has been removed from the low pressure internal fluid, the fluid may be taken from the condenser to the heat pump via low pressure conduits.

At 1014, more heat is removed from the low pressure internal fluid by the heat pump, thereby making the fluid cooler than when the fluid left the condenser. Having the low pressure internal fluid at as cool of a temperature as possible may make it easier to compress the fluid within the compressor, thereby requiring less power to be used by the compressor and resulting in an increased level of efficiency for the cooling system. In some aspects, heat that is removed from the low pressure internal fluid by the heat pump may be stored by the heat pump or an appropriate heat storage component and added to the high pressure internal fluid at 1016, or saved and stored for other purposes. Once a sufficient amount of heat has been removed from the low pressure internal fluid, the low pressure internal fluid may be taken to the compressor via a lower pressure conduit.

At 1016, the compressor compresses the internal fluid from a low pressure state to a higher pressure state, thereby increasing the temperature of the fluid. In some aspects, the compressor may be at least partially powered by energy generated by the expander at 1008 and transferred to the compressor via an energy transmission system, including any mechanical and/or electrical energy transfer techniques.

At 1018, the high pressure internal fluid may be taken by the high pressure conduit through the regenerator to absorb heat from the low pressure internal fluid in low pressure conduits before being sent to and heated again by the heat exchanger. The process 1000 may then repeat one or more additional times, or may terminate.

FIG. 10 illustrates a flowchart of a cooling process 1100. The cooling process 1100 can represent operations performed by one or more of the cooling systems described herein. At 1104, a heat exchanger takes in heat from a heat source and adds the heat to a relatively high pressure internal fluid. After being heated, the high pressure internal fluid is taken to a heat pump via high pressure conduits. At 1106, more heat is added to the high pressure internal fluid via a heat pump. This heat may come from the heat generated by the operation of the cooling system, from heat previously removed from relatively low pressure internal fluid at the inlet of a compressor, from an external power source, or another source. Heating the high pressure internal fluid as much as possible before entering an expander may allow for more energy to be generated by the internal fluid upon being expanded within expander. Once the high pressure internal fluid has been sufficiently heated, the fluid is taken to expander via high pressure conduits.

At 1108, the internal fluid within the expander is expanded and is thereby altered from a relatively high pressure state to a relatively low pressure state in a relatively short amount of time. This can generate mechanical energy while lowering the temperature of the internal fluid. This mechanical energy may be converted to an energy form capable of powering a compressor, either electrical or mechanical. Such conversion may be facilitated by mechanical transmission techniques, an electric generator and/or motor in circuit, or the like. Energy that is generated in excess of what is required by the compressor may be stored for later use, transferred to other components of the cooling system, converted to electricity by one or more generators for uses external from cooling systems, or used for another purpose. After the expansion of the internal fluid has been completed, the expanded low pressure internal fluid may be transported to regenerator via low pressure conduits.

At 1112, heat is transferred from the low pressure internal fluid to an external body and/or space by a condenser, thereby lowering the temperature of the internal fluid. In some aspects, the heat dissipated by the condenser is captured and supplied to other portions of the cooling system for later use, such as for a heat pump. Once an appropriate amount of heat has been removed from the low pressure internal fluid, the fluid may be taken from the condenser to the heat pump via low pressure conduits.

At 1114, more heat is removed from the low pressure internal fluid by the heat pump, thereby making the fluid cooler than when the fluid left the condenser. Having the low pressure internal fluid at as cool of a temperature as possible may make it easier to compress the fluid within the compressor, thereby requiring less power to be used by the compressor and resulting in an increased level of efficiency for the cooling system. In some aspects, heat that is removed from the low pressure internal fluid by the heat pump may be stored by the heat pump or an appropriate heat storage component and added to the high pressure internal fluid at 1116, or saved and stored for other purposes. Once a sufficient amount of heat has been removed from the low pressure internal fluid, the low pressure internal fluid may be taken to the compressor via a lower pressure conduit.

At 1116, the compressor compresses the internal fluid from a low pressure state to a higher pressure state, thereby increasing the temperature of the fluid. In some aspects, the compressor may be at least partially powered by energy generated by the expander at 1108 and transferred to the compressor via an energy transmission system, including any mechanical and/or electrical energy transfer techniques. The internal fluid may be sent to and heated again by the heat exchanger. The process 1100 may then repeat one or more additional times, or may terminate.

FIG. 11 illustrates a flowchart of a cooling process 1200. The cooling process 1200 can represent operations performed by one or more of the cooling systems described herein. At 1204, a heat exchanger takes in heat from a heat source and adds the heat to a relatively high pressure internal fluid. After being heated, the high pressure internal fluid is taken to an expander.

At 1208, the internal fluid within the expander is expanded and is thereby altered from a relatively high pressure state to a relatively low pressure state in a relatively short amount of time. This can generate mechanical energy while lowering the temperature of the internal fluid. This mechanical energy may be converted to an energy form capable of powering a compressor, either electrical or mechanical. Such conversion may be facilitated by mechanical transmission techniques, an electric generator and/or motor in circuit, or the like. Energy that is generated in excess of what is required by the compressor may be stored for later use, transferred to other components of the cooling system, converted to electricity by one or more generators for uses external from cooling systems, or used for another purpose. After the expansion of the internal fluid has been completed, the expanded low pressure internal fluid may be transported to regenerator via low pressure conduits.

At 1210, the regenerator transfers heat from the low pressure internal fluid in low pressure piping to the high pressure internal fluid in high pressure piping. This helps mitigate the temperature difference between the relatively hot low pressure fluid coming from the expander and the relatively cool high pressure fluid coming from the compressor. This helps reduce the amount of heat transfer required to be performed by the heat exchanger and condenser, which serves to increase the overall operational efficiency of the cooling system. Upon leaving the regenerator, the lower pressure internal fluid may be taken by the low pressure conduit to the condenser.

At 1212, heat is transferred from the low pressure internal fluid to an external body and/or space by a condenser, thereby lowering the temperature of the internal fluid. In some aspects, the heat dissipated by condenser is captured and supplied to other portions of the cooling system for later use. Once an appropriate amount of heat has been removed from the low pressure internal fluid, the fluid may be taken from the condenser to the compressor.

At 1216, the compressor compresses the internal fluid from a low pressure state to a higher pressure state, thereby increasing the temperature of the fluid. In some aspects, the compressor may be at least partially powered by energy generated by the expander at 1208 and transferred to the compressor via an energy transmission system, including any mechanical and/or electrical energy transfer techniques.

At 1218, the high pressure internal fluid may be taken by the high pressure conduit through the regenerator to absorb heat from the low pressure internal fluid in low pressure conduits before being sent to and heated again by the heat exchanger. The process 1200 may then repeat one or more additional times, or may terminate.

FIG. 12 illustrates a flowchart of a cooling process 1300. The cooling process 1300 can represent operations performed by one or more of the cooling systems described herein. At 1304, a heat exchanger takes in heat from a heat source and adds the heat to a relatively high pressure internal fluid. After being heated, the high pressure internal fluid is taken to an expander via high pressure conduits.

At 1308, the internal fluid within the expander is expanded and is thereby altered from a relatively high pressure state to a relatively low pressure state in a relatively short amount of time. This can generate mechanical energy while lowering the temperature of the internal fluid. This mechanical energy may be converted to an energy form capable of powering a compressor, either electrical or mechanical. Such conversion may be facilitated by mechanical transmission techniques, an electric generator and/or motor in circuit, or the like. Energy that is generated in excess of what is required by the compressor may be stored for later use, transferred to other components of the cooling system, converted to electricity by one or more generators for uses external from cooling systems, or used for another purpose. After the expansion of the internal fluid has been completed, the expanded low pressure internal fluid may be transported to a condenser via low pressure conduits.

At 1312, heat is transferred from the low pressure internal fluid to an external body and/or space by a condenser, thereby lowering the temperature of the internal fluid. In some aspects, the heat dissipated by condenser is captured and supplied to other portions of the cooling system for later use. Once an appropriate amount of heat has been removed from the low pressure internal fluid, the fluid may be taken from the condenser to a compressor via low pressure conduits.

At 1316, the compressor compresses the internal fluid from a low pressure state to a higher pressure state, thereby increasing the temperature of the fluid. The high pressure internal fluid may be sent to and heated again by the heat exchanger. The process 1300 may then repeat one or more additional times, or may terminate.

FIG. 13 illustrates a computing control system 500 that can control operations of the cooling systems described herein. FIG. 5 sets forth illustrative computing functionality 500, which in all cases, represents one or more physical and tangible processing mechanisms. The control system 500 may comprise volatile and non-volatile memory, such as RAM 502 and ROM 504, as well as one or more processing devices 506 (e.g., one or more central processing units (CPUs), one or more graphical processing units (GPUs), and the like). The control system 500 also optionally comprises various media devices 508, such as a hard disk module, an optical disk module, and so forth. The control system 500 may perform various operations identified when the processing device(s) 506 execute(s) instructions that are maintained by memory (e.g., RAM 502, ROM 504, and the like).

More generally, instructions and other information may be stored on any computer readable medium 510, including, but not limited to, static memory storage devices, magnetic storage devices, and optical storage devices. The term “computer readable medium” also encompasses plural storage devices. In all cases, computer readable medium 510 represents some form of physical and tangible entity. By way of example and not limitation, computer readable medium 510 may comprise “computer storage media” and “communications media.”

“Computer storage media” comprises volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information, such as computer readable instructions, data structures, program modules, or other data. Computer storage media may be, for example, and not limitation, RAM 502, ROM 504, EEPROM, Flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer.

“Communication media” typically comprise computer readable instructions, data structures, program modules, or other data in a modulated data signal, such as carrier wave or other transport mechanism. Communication media may also comprise any information delivery media. The term “modulated data signal” means a signal that has one or more of its characteristics set or changed in such a manner as to encode information in the signal. By way of example, and not limitation, communication media comprises wired media such as wired network or direct-wired connection, and wireless media such as acoustic, RF, infrared, and other wireless media. Combinations of any of the above are also included within the scope of computer readable medium.

The control system 500 may also comprise an input/output module 512 (I/O in FIG. 5) for receiving various inputs (via input modules 514), and for providing various outputs (via one or more output modules). One particular output module mechanism may be a presentation module 516 and an associated GUI 518. Computing functionality 500 may also include one or more network interfaces 520 for exchanging data with other devices via one or more communication conduits 522. In some aspects, one or more communication buses 524 communicatively couple the above-described components together.

Communication conduit(s) 522 may be implemented in any manner (e.g., by a local area network, a wide area network (e.g., the Internet), and the like, or any combination thereof). Communication conduit(s) 522 may include any combination of hardwired links, wireless links, routers, gateway functionality, name servers, and the like, governed by any protocol or combination of protocols.

Alternatively, or in addition, any of the functions described herein may be performed, at least in part, by one or more hardware logic components. For example, without limitation, illustrative types of hardware logic components that may be used include Field-programmable Gate Arrays (FPGAs), Application-specific Integrated Circuits (ASICs), Application-specific Standard Products (ASSPs), System-on-a-chip systems (SOCs), Complex Programmable Logic Devices (CPLDs), and the like.

The terms “module” and “component” as used herein generally represent software, firmware, hardware, or any combination thereof. In the case of a software implementation, the module or component represents program code that performs specified tasks when executed on one or more processors. The program code may be stored in one or more computer readable memory devices, as described with reference to FIG. 5. The features of the present disclosure described herein are platform-independent, meaning the techniques can be implemented on a variety of commercial computing platforms having a variety of processors (e.g., desktop, laptop, notebook, tablet computer, personal digital assistant (PDA), mobile telephone, smart telephone, gaming console, and the like).

In some aspects, one or more computing devices may be communicatively coupled to and/or integrated with cooling system, either wirelessly or via wired connectivity, either directly or via one or more networks (such as the global public Internet or a private intranet network or local area network) in order to allow one or more users to interact with, view, and/or control the cooling system. For example, the control system 500 can be used to set a time for how long cooling system operates, to toggle cooling system between an on mode and an off mode, to set a target temperature for one or more heat sources 102 to be achieved using cooling system, to view a temperature, pressure, volume, and/or enthalpy of at least one portion of the internal fluid within cooling system, to view a temperature of at least one heat source 102 being cooled by cooling system, etc. One or more users may interact with cooling system via the control system 500 (e.g., via one or more control panels integrated with at least one portion of cooling system or via one or more input devices (such as, for example and not limitation, a mouse, keyboard, touchscreen, joystick, microphone, camera, scanner, chip reader, card reader, magnetic stripe reader, near field communication technology, and the like) that may be associated with at least one computing device communicatively coupled to cooling system and that may configured to manipulate at least one graphical user interface presented by the computing device(s) upon at least one display screen. By way of example and not limitation, a computing device may comprise a desktop computer, a laptop computer, a tablet or mobile computer, a smartphone (alternatively referred to as a mobile device), a Personal Digital Assistant (PDA), a mobile phone, a handheld scanner, any commercially-available intelligent communications device, or the like. In some additional aspects, the one or more computing devices may be configured with various computational instructions, or code, in the form of software or one or more software applications that, when executed on at least one computer processor, causes the at least one computer processor to perform certain steps or processes, including steps or processes that may enable the one or more computing devices to control one or aspects of cooling system in an at least partially autonomous way (e.g., one or more computing devices may be programmed to cause cooling system to maintain a given heat source 102 at a certain temperature level and/or to run for a certain amount of time).

In one embodiment, a cooling system includes a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid and a stack heat recovery steam generator fluidly coupled with the heat exchanger and configured to receive the internal fluid that is heated by the thermal energy transferred to the internal fluid by the heat exchanger. The stack heat recovery steam generator is configured to heat the internal fluid received from the heat exchanger. The cooling system also includes an expander fluidly coupled with the stack heat recovery steam generator and configured to reduce a pressure of the internal fluid that is received from the stack heat recovery steam generator. The expander is configured to be coupled with a generator and to drive the generator to generate electric current. The cooling system includes a first air-cooled condenser fluidly coupled with the expander and configured to be conductively coupled with the generator. This first air-cooled condenser is configured to receive the internal fluid from the expander and to air cool the internal fluid. The first air-cooled condenser also is configured to be powered by the electric current generated from the expander driving the generator. The cooling system also includes a compressor fluidly coupled with the first air-cooled condenser and configured to be conductively coupled with the generator. The compressor is configured to increase the pressure of the internal fluid and to be powered by the electric current generated from the expander driving the generator. The cooling system includes a second air-cooled condenser fluidly coupled with the compressor and configured to be conductively coupled with the generator. This second air-cooled condenser is configured to receive the internal fluid from the compressor and to air cool the internal fluid. The second air-cooled condenser also is configured to be powered by the electric current generated from the expander driving the generator. The cooling system also includes an expansion valve fluidly coupled with the second air-cooled condenser and with the heat exchanger such that the expansion valve is between the second air-cooled condenser and the heat exchanger. The expansion valve is configured to reduce the pressure of the internal fluid before returning the fluid to the heat exchanger.

Optionally, the heat source includes a computer, a computer processor, or a server and the thermal energy is waste heat generated as a byproduct of operation of the heat source.

The stack heat recovery steam generator may be separate from the heat exchanger and is configured to increase both a temperature and enthalpy of the internal fluid received from the heat exchanger by heating the internal fluid with additional thermal energy from the heat source. The first air-cooled condenser and the second air-cooled condenser may transfer at least some of the thermal energy of the internal fluid to ambient air without transferring any of the thermal energy of the internal fluid to water.

The stack heat recovery steam generator may be directly downstream of the heat exchanger along a direction in which the internal fluid flows. The expander may be directly downstream of the stack heat recovery steam generator along the direction in which the internal fluid flows. The first air-cooled condenser may be directly downstream of the expander along the direction in which the internal fluid flows. The compressor can be directly downstream of the first air-cooled condenser along the direction in which the internal fluid flows. The second air-cooled condenser may be directly downstream of the compressor along the direction in which the internal fluid flows. The expansion valve can be directly downstream of the second air-cooled condenser along the direction in which the internal fluid flows. The heat exchanger can be directly downstream of the expansion valve along the direction in which the internal fluid flows.

Another example of a cooling system includes a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid, an expander fluidly coupled with the heat exchanger and configured to reduce a pressure of the internal fluid received from the heat exchanger, a first air-cooled condenser fluidly coupled with the expander and configured to air cool the internal fluid that is received from the expander, a compressor fluidly coupled with the first air-cooled condenser and configured to increase the pressure of the internal fluid received from the first air-cooled condenser, and a second air-cooled condenser fluidly coupled with the compressor and configured to air cool the internal fluid received from the compressor.

Optionally, the expander is configured to be coupled with a generator and to drive the generator to generate electric current. The first air-cooled condenser may be configured to be powered by the electric current generated from the expander driving the generator. The compressor may be configured to be powered by the electric current generated from the expander driving the generator.

The second air-cooled condenser can be powered by the electric current generated from the expander driving the generator. The cooling system optionally also includes a stack heat recovery steam generator fluidly coupled with the heat exchanger and configured to receive the internal fluid that is heated by the thermal energy transferred to the internal fluid by the heat exchanger. The stack heat recovery steam generator can be configured to further heat the internal fluid received from the heat exchanger.

Optionally, the stack heat recovery steam generator is separate from the heat exchanger and is configured to increase both a temperature and enthalpy of the internal fluid received from the heat exchanger by heating the internal fluid with additional thermal energy from the heat source. The cooling system also may include an expansion valve fluidly coupled with the second air-cooled condenser and with the heat exchanger such that the expansion valve is between the second air-cooled condenser and the heat exchanger. The expansion valve can reduce the pressure of the internal fluid before returning the internal fluid to the heat exchanger.

The heat source can include a computer, a computer processor, or a server and the thermal energy is waste heat generated as a byproduct of operation of the heat source.

The first air-cooled condenser and the second air-cooled condenser may transfer at least some of the thermal energy of the internal fluid to ambient air without transferring any of the thermal energy of the internal fluid to water. Optionally, the expander is downstream of the heat exchanger along a direction in which the internal fluid flows, the first air-cooled condenser is directly downstream of the expander along the direction in which the internal fluid flows, the compressor is directly downstream of the first air-cooled condenser along the direction in which the internal fluid flows, the second air-cooled condenser is directly downstream of the compressor along the direction in which the internal fluid flows, and the heat exchanger is downstream of the second air-cooled condenser along the direction in which the internal fluid flows.

In one embodiment, a cooling method includes transferring thermal energy from a heat source to an internal fluid using a heat exchanger, reducing a pressure of the internal fluid received from the heat exchanger using an expander that is fluidly coupled with the heat exchanger, air cooling the internal fluid that is received from the expander in a first air-cooled condenser that is fluidly coupled with the expander, increasing the pressure of the internal fluid received from the first air-cooled condenser in a compressor that is fluidly coupled with the first air-cooled condenser, and air cooling the internal fluid that is received from the compressor in a second air-cooled condenser that is fluidly coupled with the compressor.

The internal fluid can be air cooled by the first air-cooled condenser and the second air-cooled condenser transferring at least some of the thermal energy of the internal fluid to ambient air without transferring any of the thermal energy of the internal fluid to water. The heat source can include a computer, a computer processor, or a server and the thermal energy is waste heat generated as a byproduct of operation of the heat source. The expander can be configured to be coupled with a generator and to drive the generator to generate electric current.

While various aspects of the present disclosure have been described above, it should be understood that they have been presented by way of example and not limitation. Various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure. Thus, the present disclosure should not be limited by any of the above described example aspects, but should be defined only in accordance with the following claims and their equivalents.

In addition, it should be understood that the figures in the attachments, which highlight the structure, methodology, functionality, and advantages of the present disclosure, are presented for example purposes only. The present disclosure is sufficiently flexible and configurable, such that it may be implemented in ways other than that shown in the accompanying figures (e.g., utilization with different heat sources; utilization with different systems, methods, processes, apparatus, devices, and components other than those mentioned herein). Certain features from different aspects of the systems and methods of the present disclosure may be combined to form yet new aspects of the present disclosure.

Further, the purpose of the foregoing Abstract is to enable the U.S. Patent and Trademark Office and the public generally and especially the scientists, engineers and practitioners in the relevant art(s) who are not familiar with patent or legal terms or phraseology, to determine quickly from a cursory inspection the nature and essence of this technical disclosure. The Abstract is not intended to be limiting as to the scope of the present disclosure in any way. 

What is claimed is:
 1. A cooling system comprising: a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid; a stack heat recovery steam generator fluidly coupled with the heat exchanger and configured to receive the internal fluid that is heated by the thermal energy transferred to the internal fluid by the heat exchanger, the stack heat recovery steam generator configured to heat the internal fluid received from the heat exchanger; an expander fluidly coupled with the stack heat recovery steam generator and configured to reduce a pressure of the internal fluid that is received from the stack heat recovery steam generator, the expander configured to be coupled with a generator and to drive the generator to generate electric current; a first air-cooled condenser fluidly coupled with the expander and configured to be conductively coupled with the generator, the first air-cooled condenser configured to receive the internal fluid from the expander and to air cool the internal fluid, the first air-cooled condenser also configured to be powered by the electric current generated from the expander driving the generator; a compressor fluidly coupled with the first air-cooled condenser and configured to be conductively coupled with the generator, the compressor configured to increase the pressure of the internal fluid, the compressor also configured to be powered by the electric current generated from the expander driving the generator; a second air-cooled condenser fluidly coupled with the compressor and configured to be conductively coupled with the generator, the second air-cooled condenser configured to receive the internal fluid from the compressor and to air cool the internal fluid, the second air-cooled condenser also configured to be powered by the electric current generated from the expander driving the generator; and an expansion valve fluidly coupled with the second air-cooled condenser and with the heat exchanger such that the expansion valve is between the second air-cooled condenser and the heat exchanger, the expansion valve configured to reduce the pressure of the internal fluid before returning the fluid to the heat exchanger.
 2. The cooling system of claim 1, wherein the heat source includes a computer, a computer processor, or a server and the thermal energy is waste heat generated as a byproduct of operation of the heat source.
 3. The cooling system of claim 1, wherein the stack heat recovery steam generator is separate from the heat exchanger and is configured to increase both a temperature and enthalpy of the internal fluid received from the heat exchanger by heating the internal fluid with additional thermal energy from the heat source.
 4. The cooling system of claim 1, wherein the first air-cooled condenser and the second air-cooled condenser transfer at least some of the thermal energy of the internal fluid to ambient air without transferring any of the thermal energy of the internal fluid to water.
 5. The cooling system of claim 1, wherein the stack heat recovery steam generator is directly downstream of the heat exchanger along a direction in which the internal fluid flows, the expander is directly downstream of the stack heat recovery steam generator along the direction in which the internal fluid flows, the first air-cooled condenser is directly downstream of the expander along the direction in which the internal fluid flows, the compressor is directly downstream of the first air-cooled condenser along the direction in which the internal fluid flows, the second air-cooled condenser is directly downstream of the compressor along the direction in which the internal fluid flows, the expansion valve is directly downstream of the second air-cooled condenser along the direction in which the internal fluid flows, and the heat exchanger is directly downstream of the expansion valve along the direction in which the internal fluid flows.
 6. A cooling system comprising: a heat exchanger configured to transfer thermal energy from a heat source to an internal fluid; an expander fluidly coupled with the heat exchanger and configured to reduce a pressure of the internal fluid received from the heat exchanger; a first air-cooled condenser fluidly coupled with the expander and configured to air cool the internal fluid that is received from the expander; a compressor fluidly coupled with the first air-cooled condenser and configured to increase the pressure of the internal fluid received from the first air-cooled condenser; and a second air-cooled condenser fluidly coupled with the compressor and configured to air cool the internal fluid received from the compressor.
 7. The cooling system of claim 6, wherein the expander is configured to be coupled with a generator and to drive the generator to generate electric current.
 8. The cooling system of claim 7, wherein the first air-cooled condenser is configured to be powered by the electric current generated from the expander driving the generator.
 9. The cooling system of claim 7, wherein the compressor is configured to be powered by the electric current generated from the expander driving the generator.
 10. The cooling system of claim 7, wherein the second air-cooled condenser is configured to be powered by the electric current generated from the expander driving the generator.
 11. The cooling system of claim 6, further comprising: a stack heat recovery steam generator fluidly coupled with the heat exchanger and configured to receive the internal fluid that is heated by the thermal energy transferred to the internal fluid by the heat exchanger, the stack heat recovery steam generator configured to further heat the internal fluid received from the heat exchanger.
 12. The cooling system of claim 11, wherein the stack heat recovery steam generator is separate from the heat exchanger and is configured to increase both a temperature and enthalpy of the internal fluid received from the heat exchanger by heating the internal fluid with additional thermal energy from the heat source.
 13. The cooling system of claim 6, further comprising: an expansion valve fluidly coupled with the second air-cooled condenser and with the heat exchanger such that the expansion valve is between the second air-cooled condenser and the heat exchanger, the expansion valve configured to reduce the pressure of the internal fluid before returning the internal fluid to the heat exchanger.
 14. The cooling system of claim 6, wherein the heat source includes a computer, a computer processor, or a server and the thermal energy is waste heat generated as a byproduct of operation of the heat source.
 15. The cooling system of claim 6, wherein the first air-cooled condenser and the second air-cooled condenser transfer at least some of the thermal energy of the internal fluid to ambient air without transferring any of the thermal energy of the internal fluid to water.
 16. The cooling system of claim 6, wherein the expander is downstream of the heat exchanger along a direction in which the internal fluid flows, the first air-cooled condenser is directly downstream of the expander along the direction in which the internal fluid flows, the compressor is directly downstream of the first air-cooled condenser along the direction in which the internal fluid flows, the second air-cooled condenser is directly downstream of the compressor along the direction in which the internal fluid flows, and the heat exchanger is downstream of the second air-cooled condenser along the direction in which the internal fluid flows.
 17. A cooling method comprising: transferring thermal energy from a heat source to an internal fluid using a heat exchanger; reducing a pressure of the internal fluid received from the heat exchanger using an expander that is fluidly coupled with the heat exchanger; air cooling the internal fluid that is received from the expander in a first air-cooled condenser that is fluidly coupled with the expander; increasing the pressure of the internal fluid received from the first air-cooled condenser in a compressor that is fluidly coupled with the first air-cooled condenser; and air cooling the internal fluid that is received from the compressor in a second air-cooled condenser that is fluidly coupled with the compressor.
 18. The method of claim 17, wherein the internal fluid is air cooled by the first air-cooled condenser and the second air-cooled condenser transferring at least some of the thermal energy of the internal fluid to ambient air without transferring any of the thermal energy of the internal fluid to water.
 19. The method of claim 17, wherein the heat source includes a computer, a computer processor, or a server and the thermal energy is waste heat generated as a byproduct of operation of the heat source.
 20. The method of claim 17, wherein the expander is configured to be coupled with a generator and to drive the generator to generate electric current. 